Button 6
Button 1
Button 2
Technologies
Button 3
Button 4
Button 5



Default Image





 

PCB Environmental Issues

 

Lead Free
Brominated Halogen Free


Lead Free Surface Finish

  • Flash Gold Plating
  • Selective gold plating (Hard/Soft Gold)
  • ENIG (Electroless Nickel and Immersion Gold)
  • Immersion Tin
  • Immersion Silver
  • OSP (Organic Surface Protection)
  • Pure Tin Hot Air Leveling

Brominated Flame Retardants
  • PBB (Polybrominated Biphenyls)
    PBB is no longer used.
  • PBDE (Polybrominated Diphenyl Ether)
    PBDE banned after 2004.
  • TBBPA (Tetrabromobisphenol-A)
    TBBPA is not restricted in any country.
 
Halogen Free Flame Retardants
  • Most common non Halogenated flame retardants.

    Inorganics: metal oxides and hydroxides, phosphates, and red phosphorus.

    Organo: phosphors, phosphate esters and nitrogen compounds
 
Halogen Free Laminates
Company
Material
Tg
Matsushita
R1566, R1551
150oC
Toshiba
TLC 555
-
Hitachi
BE67G
145oC
Kyocera
TLC552
165oC
ITEQ
IT 140G
130oC
Nelco
N 4000-2EF
150oC
Polyclad
HF541
140oC
Polyclad
HF571
160oC
ISOLA
Duraver 156
150oC
Shengyi
S1155
135oC

 


HomeAbout UsProductsTechnologiesServicesContact UsSite Map
Web Site Design by: Two Brothers Web Design