Layers

• 1 – 40 Layer

Material

• FR-4
• CEM 1 & 2
• High Tg
• High Speed / High Frequency
• Metal Core

Soldermask

• L.P.I. (Green, White, Red, Blue and Black)

Finish

• Hal, Immersion Gold
• Immersion Tin
• OSP
• Ni Au Plating
• Gold Finger
• Carbon Ink
• Peelable Mask

Profile

• Tab Rout
• Blank
• V. Score
• Internal Cut Out

Special Technology

• Blind – Buried Via
• Buried Resistors
• Laser Drill HDI
• Heavy Copper PCB
• Mix Material PCB
• Impedance Control