Fabrication Specs
Board Dimensions Dimensions
Max Panel Size 21″ X 24″
Max Board Size 18″ X 20″
Board Thickness Tolerance +/- 10%
Max warp and twist 75%
Max Rigid Board Thickness .125″
Min Rigid Board Thickness .012″
Min Flex Board Thickness 53 microns
Min Core Thickness .005″
Copper Weight
Min Copper Weight 1/2 ounce per sq. ft.
Max Copper Weight 5 ounces per sq. ft.
Trace Width and Spacing Inner and outer layers
1/3 and 1/2 ounce min .003” line .004″ space
1 ounce min .005″ line .005″ space
2 ounce min .005″ line .008″ space
3 ounce min .008″ line .010″ space
4 ounce min .010″ line .013″ space
5 ounce min .010″ line .018″ space
Line width tolerance the lesser of +/- 20% or +/- .002″
Hole and Pad
Min Drilled hole Dia. .010″
Min Finished hole Dia. .008″
HDI Capability: Laser Drill Yes
Finished hole Dia. Tolerance +/- .003″
Drilled hole location tolerance +/- .003″
Min Copper thickness in PTH .0008″
Max aspect ratio 8:1
Min annular ring .005″
Innerlayer
Layer to layer registration +/- .004″
Min dilectric thickness .003″
Max layer count 16
Soldermask LPI
Soldermask registration tolerance +/- .003″
Min trace to pad spacing +/- .006″
Min soldermask dam .004″
Min soldermask annular ring .003″
LPI colors available Green, Red, Blue, Black, and LED White
Via plugging Yes
Silkscreen Legend
Min line width .005″
Legend registration tolerance +/- .006″
Serialization Yes
Board Profile, Rout, Score, Chamfer
Min space between boards (rout) .100″
Min. Edge to edge tolerance .005″
V-Score thickness tolerance “+/- .004″
V-Score Angles 30, 45, 60 degrees
Chamfer Angles 20, 30, 45 degrees
Electrical Test
Min test point width .010″
Min test point pitch .014″