Board Dimensions |
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Max Panel Size |
21" X 24" |
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Max Board Size |
18" X 20" |
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Board Thickness Tolerance |
+/- 10% |
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Max warp and twist |
.75% |
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Max Rigid Board Thickness |
.125" |
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Min Rigid Board Thickness |
.012" |
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Min Flex Board Thickness |
53 microns |
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Min Core Thickness |
.005" |
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Copper Weight |
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Min Copper Weight |
1/2 ounce per sq. ft. |
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Max Copper Weight |
5 ounces per sq. ft. |
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Trace Width and Spacing Inner and outer layers |
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1/3 and 1/2 ounce |
min .003'' line .004" space |
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1 ounce |
min .005" line .005" space |
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2 ounce |
min .005" line .008" space |
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3 ounce |
min .008" line .010" space |
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4 ounce |
min .010" line .013" space |
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5 ounce |
min .010" line .018" space |
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Line width tolerance |
the lesser of +/- 20% or +/- .002" |
Hole and Pad |
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Min Drilled hole Dia. |
.010" |
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Min Finished hole Dia. |
.008" |
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HDI Capability: Laser Drill |
Yes |
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Finished hole Dia. Tolerance |
+/- .003" |
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Drilled hole location tolerance |
+/- .003" |
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Min Copper thickness in PTH |
.0008" |
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Max aspect ratio |
8:1 |
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Min annular ring |
.005" |
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Innerlayer |
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Layer to layer registration |
+/- .004" |
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Min dilectric thickness |
.003" |
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Max layer count |
16 |
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Soldermask LPI |
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Soldermask registration tolerance |
+/- .003" |
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Min trace to pad spacing |
+/- .006" |
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Min soldermask dam |
.004" |
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Min soldermask annular ring |
.003" |
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LPI colors available |
Green, Red, Blue, Black, and LED White |
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Via plugging |
Yes |
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Silkscreen Legend |
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Min line width |
.005" |
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Legend registration tolerance |
+/- .006" |
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Serialization |
Yes |
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Board Profile, Rout, Score, Chamfer |
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Min space between boards (rout) |
.100" |
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Min. Edge to edge tolerance |
.005" |
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V-Score thickness tolerance |
"+/- .004" |
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V-Score Angles |
30, 45, 60 degrees |
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Chamfer Angles |
20, 30, 45 degrees |
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Electrical Test |
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Min test point width |
.010" |
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Min test point pitch |
.014" |
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