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Lead & Halogen Free PCB
| PCB Exposed Metal Finish |
RoHS Compliant? |
| Flash Gold Plating |
Yes |
| Selective gold plating (Hard/Soft Gold) |
Yes |
| ENIG (Electroless Nickel and Immersion Gold) |
Yes |
| Immersion Tin |
Yes |
| Immersion Silver |
Yes |
| OSP (Organic Surface Protection) |
Yes |
| Lead Free HASL |
Yes |
| Carbon Ink |
Yes |
| HASL (Eutectic Solder) |
No |
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| Material Substrates |
| FR-4 |
Tg 135C |
| FR-4 |
Tg 180C |
| FR-4 |
Halogen Free (See Below) |
| CEM |
1 |
| CEM |
2 |
| CEM |
3 |
| Metal Core, Aluminum |
.024" min .063" max |
| Metal Core, Copper |
| MCPCB Dielectric |
Arlon |
| MCPCB Dielectric |
Berquist |
| MCPCB Dielectric |
Totking |
| Embedded Capacitance |
3M |
| Flex , Polyimide (Kapton) |
Dupont |
| Rigid-Flex |
Dupont |
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| Halogen Free Laminates |
| Company |
Material |
Tg |
| Matsushita |
R1566, R1551 |
150oC |
| Toshiba |
TLC 555 |
- |
| Hitachi |
BE67G |
145oC |
| Kyocera |
TLC552 |
165oC |
| ITEQ |
IT 140G |
130oC |
| Nelco |
N 4000-2EF |
150oC |
| Polyclad |
HF541 |
140oC |
| Polyclad |
HF571 |
160oC |
| ISOLA |
Duraver 156 |
150oC |
| Shengyi |
S1155 |
135oC |
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